Testing Power and Microelectronic Interconnects
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چکیده
Inequalities in thermomechanical properties of materials at interfaces of a modern package lead to a rise in periodic stresses during normal operation, making these sites crucial to the integrity of the entire product. Proper lifetime analysis for highly miniaturized interconnects is a real challenge. In addition, broad application of 100% quality standards in various industries has caused a rapid growth in meeting reliability demands in the electronics packaging industry. Introduction of novel materials and a dramatic reduction in the time-tomarket (down to 6 weeks) has put pressure on supply chain requirements; therefore, faster and tighter quality assessment of designed components is essential.
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Testing Power and Microelectronic Interconnects
Inequalities in thermomechanical properties of materials at interfaces of a modern package lead to a rise in periodic stresses during normal operation, making these sites crucial to the integrity of the entire product. Proper lifetime analysis for highly miniaturized interconnects is a real challenge. In addition, broad application of 100% quality standards in various industries has caused a ra...
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